Die Attach
BizLink offers cables and cable assemblies for bonding systems. Bonding is a key technology for manufacturing semiconductors. BizLink equips this machinery with highly flexible clean room cables. Best properties for speed, acceleration with lowest environment contaminations plus best EMV conditions BizLink combines with long flex life for less maintenance issues. Our customers are leading suppliers of semiconductor assembly equipment for the global semiconductor and electronics industries. we fulfil all requirements for flip chip bonding, wire bonding, die bonding, soft solder die bonding, multi module attach and laser bonding.